Heat dissipation specifications for S-series I/O and DeltaV Smart Switches

Heat dissipation is based on the power consumption of each component and includes some heat generated by the I/O signal, such as the load resistor of an AI channel. System power supplies and bulk power supplies also dissipate heat proportional to the load they are servicing as a result of internal efficiency. Use the heat dissipation values in this table to calculate the heat load of the system or the heat load in a cabinet. When calculating the heat load in a cabinet, be sure to include only the components in that cabinet.

Note

The values in the following table are based on 75% efficiency for the System Power Supply (24 VDC) and 91% efficiency for the Bulk Power Supply.

Table: Heat dissipation for S-series I/O and controllers
Product	Heat dissipation per unit (Watts)	System heat dissipation (Watts)
Product	Use these values if external power is used.	Use these values to calculate the heat generated from the S-series cards, system power supplies, and bulk power supplies.
Controllers (SD Plus, SX, SQ)	4.7	8.4
AI 8-channel, 4-20 mA, HART	Simplex: 5.4 Redundant: 6.1	Simplex: 6.8 Redundant: 8.5
AI 16-channel, 4-20 mA, HART	7.7	9.1
AO 8-channel 4-20 mA HART	Simplex: 7.1 Redundant: 7.2	Simplex: 8.6 Redundant: 9.6
AS-Interface	7.0	9.8
DeviceNet	8.2	13.9
DI 8-channel NAMUR (simplex or redundant)	3.0	4.5
DI 8-channel 24 VDC isolated	3.1	4.1
DI 8-channel 120 VAC dry contact	2.9	3.9
DI 8-channel 120 VAC isolated	2.9	3.9
DI 32-channel 24 VDC dry contact	4.2	4.9
DO 8-channel 24 VDC high-side (simplex or redundant)	3.9	5.3
DO 8-channel 24 VDC isolated	4.2	5.6
DO 8-channel 120/230 VAC high-side	5.4	6.8
DO 8-channel 120/230 VAC isolated	5.4	6.8
DO 32-channel 24 VDC high-side	4.0	5.4
Fieldbus H1 (simplex or redundant)	4.4	7.3
Fieldbus H1 4-port Plus (simplex or redundant)	4.4	7.3
H1 card with integrated power	3.7	8.0
Isolated input	4.2	7.6
Pulse count input	5.9	8.3
Profibus DP (simplex or redundant)	7.2	13
RTD / Resistance input	1.9	3.5
Sequence of Events	2.5	3.3
Serial card (simplex or redundant)	3.6	6.5
Thermocouple / mV input	4.2	7.6

Table: Heat dissipation for CHARMs I/O
Product	Heat dissipation (Watts)
CHARM I/O card	8.0 maximum per redundant CIOC node: 2 W per CIOC 2 W per fiber-optic I/O port or 1.3 W per copper I/O port
24 VDC Power CHARM	0.32
AI 0-10 VDC CHARM	0.40
AI 4-20 mA HART CHARM	0.33
I.S. AI 4-20 mA HART CHARM	0.86 (includes terminal block)
AO 4-20 mA HART CHARM	0.48
I.S. AO 4-20 mA HART CHARM	1.1 (includes terminal block)
DI 24 VDC isolated CHARM	0.32
DI 120 VAC isolated CHARM	0.41
DI 230 VAC isolated CHARM	0.40
DI 24 VDC dry contact CHARM	0.33
DI NAMUR CHARM	0.51
I.S. DI NAMUR CHARM	0.57 (includes terminal block)
DO 24 VDC high-side CHARM	0.44
DO 24 VDC isolated CHARM	0.46
I.S. DO 45 mA CHARM	1.4 (includes terminal block)
DO 100 mA energy limited CHARM	0.56
DO 120/230 VAC isolated CHARM	0.7
RTD / Resistance input CHARM	0.30
I.S. RTD / Resistance input CHARM	0.60
Thermocouple / mV input CHARM	0.30
I.S. Thermocouple / mV input CHARM	0.60

Table: Heat dissipation for DeltaV Smart Switches and Media Modules
Product	Heat dissipation (Watts)
FP20-6TX2TX FP20-6TX2TX-ES	5.3
FP20-6TX1MM1TX FP20-6TX1MM1TX-ES FP20-6TX1SM1TX FP20-6TX1SM1TX-ES FP20-6TX1SMLH1TX FP20-6TX1SMLH1TX-ES	6.5
FP20-6TX2MM FP20-6TX2MM-ES FP20-6TX2SM FP20-6TX2SM-ES	7.7
FP20-6TX2TX FP20-6TX2TX-ES	5.3
MD20-8 MD20-8-ES	5.0 at 24 VDC 7.4 at 48 VDC
MD20-16 MD20-16-ES MD20-24 MD20-24-ES	12.0 at 24 VDC 15.6 at 48 VDC
MD30-8 MD30-8-ES	5.6 at 24 VDC 8.6 at 48 VDC
MD30-16 MD30-16-ES MD30-24 MD30-24-ES	12.6 at 24 VDC 16.8 at 48 VDC
MD4-2TX/SFP MD4-2TX/SFP-ES	5.8
MD2-2FXM2 MD2-2FXM2-ES MD2-2FXS2 MD2-2FXS2-ES	3.8
MD2-4TX1 MD2-4TX1-ES	0.8
MD3-2FXM2/2TX1 MD3-2FXM2/2TX1-ES MD3-2FXS2/2TX1 MD3-2FXS2/2TX1-ES	3.8
MD3-4FXM2 MD3-4FXM2-ES MD3-4FXM4 MD3-4FXM4-ES MD3-4FXS2 MD3-4FXS2-ES	6.8
MD3-2FXM4/2TX1 MD3-2FXM4/2TX1-ES	3.8
MD3-1FXS2/3TX1 MD3-1FXS2/3TX1-ES	2.3
MD2-4TX1-PoE MD2-4TX1-PoE-ES	0.8
RM-100-Base Smart Switch	12.0
RM-100-Base Smart Switch-RP	13.0
RM100-8TX	12.0
RM100-24TX	16.0
RM100-EM-8TX	2.0
RM100-EM-8MM-FX	10.0
RM100-EM-8SM-FX	10.0
RM100-EM-8SFP	11.0 (including SFP)

Table: Heat dissipation for the Wireless I/O Card
Product	Heat dissipation (Watts)
WirelessHART I/O card (WIOC)	11 W maximum per redundant WIOC node: 3.5 W for each WIOC 2 W each fiber optic I/O port or 1.34 W each copper I/O port

Table: Heat dissipation for power supplies and redundancy modules
Product	Heat dissipation (Watts)
System power supply (24 VDC)	5.2
100-240 VAC to 12 VDC 15 A DeltaV Bulk Power Supply	17.8 at 110 VDC 16.7 at 120 VAC 16.1 at 230 VAC
100-240 VAC to 24 VDC 5 A DeltaV Bulk Power Supply	11.9 at 110 VDC 11.0 at 120 VAC 9.4 at 230 VAC
100-240 VAC to 24 VDC 10 A DeltaV Bulk Power Supply	21.4 at 110 VDC 19.1 W at 120 VAC 16.7 W at 230 VAC
100-240 VAC to 24 VDC 20 A DeltaV Bulk Power Supply	41.8 at 110 VDC 39.6 at 120 VAC 31.4 at 230 VAC
100-240 VAC to 24 VDC 40 A DeltaV Bulk Power Supply	65.6 at 120 VAC 54.8 at 230 VAC
12-48 VDC 20 A DeltaV Bulk Power Supply Redundancy Module	0 at no load (typical) 7.8 at 2x 5 A input (typical) 8.5 at 1x 10 A input (typical) 17 at 2x 10 A input (typical)
12-24 VDC 40 A DeltaV Bulk Power Supply Redundancy Module	700 mW at no load input (typical) 2.15 at 2x 10 A input (typical) 2.65 at 1x 20 A input (typical) 6.3 at 2x 20 A input (typical)
12-24 VDC 80 A DeltaV Bulk Power Supply Redundancy Module	700 mW at no load (typical) 2.7 at 2x 20 A input (typical) 3.6 at 1x 40 A input (typical) 8.3 at 2x 40 A input (typical)